Categories: FutureMaterialsMessangerPlatformTechnologyWireless
Thintronics is a technology platform, a company, and a vision for the future of interconnects and advanced packaging.
Investors 1
Funding Rounds 1
| Date | Series | Amount | Investors |
| 29.04.2024 | Series A | $23M | - |
Mentions in press and media 6
| Date | Title | Description |
| 11.03.2026 | From toilets to MSG: Four unlikely winners of the AI boom | Believe it or not, Toto, the Japanese toilet and bidet maker, has become one of the more improbable stock success stories of the AI boom.
The company produces electrostatic ‘chucks’, components critical to memory chip production, and when a... |
| 15.08.2024 | Thintronics Closes Its Series A Extension | Thintronics, Inc., a Berkeley, CA-based electronic materials startup, raised an undisclosed amount in Series A extension.
The round was led by Maverick Capital and Translink Capital with participation from M Ventures, the CVC arm of Merck K... |
| 01.05.2024 | Thintronics: Revolutionizing Electronic Materials | Thintronics, a California-based electronic materials startup, has closed a $23 million Series A funding round, led by Maverick Capital and Translink Capital. The company is on a mission to disrupt the industry by supplying high-performance ... |
| 29.04.2024 | Thintronics Closes $23M Series A Financing Round | Thintronics, a Berkeley, CA-based electronic materials startup, raised $23M in Series A funding.
The round was led by Maverick Capital and Translink Capital.
The company intends to use the funds to support commercialization of a novel insul... |
| - | Thintronics: Electronic Materials Company Closes $23 Million | Thintronics is a California-based electronic materials startup that supplies high-performance insulators for emerging AI data centers, networking, and RF/millimeter-wave (mmW) applications. It raised a $23 million Series A funding round, le... |
| - | Thintronics | “More Data Faster. Merging PCB, Substrate, and Semiconductor Packaging into a revolutionary new insulator material for the next generation of Interconnects.” |
Reviews 0
