Teramount changes the world of optical connectivity by offering a novel solution for connecting optics to silicon.
Silicon-photonics, which realizes speed of light data transfer at low power consumption, is the most promising technology enabler for the next generation of high-speed data transfer in data centers, cloud computing, HPC and other datacom applications. One of the main challenges of next-generation data center co-packaged switches is scalability of fiber-to-chip connectivity - the ability to reliably connect hundreds of fibers to a single switch chip at high yield and low cost.
Teramount Photonic-plug’s technology demonstrated 100X improved tolerance in assembling fiber to silicon chip compared to existing technologies, enabling successful integration of optics with silicon and scalable deployment of silicon photonics. With this, Teramount is solving a major obstacle of next-generation data center co-packaged switches thus, enabling a reliable and dense-fiber connectivity at high yield and low cost.
Silicon-photonics, which realizes speed of light data transfer at low power consumption, is the most promising technology enabler for the next generation of high-speed data transfer in data centers, cloud computing, HPC and other datacom applications. One of the main challenges of next-generation data center co-packaged switches is scalability of fiber-to-chip connectivity - the ability to reliably connect hundreds of fibers to a single switch chip at high yield and low cost.
Teramount Photonic-plug’s technology demonstrated 100X improved tolerance in assembling fiber to silicon chip compared to existing technologies, enabling successful integration of optics with silicon and scalable deployment of silicon photonics. With this, Teramount is solving a major obstacle of next-generation data center co-packaged switches thus, enabling a reliable and dense-fiber connectivity at high yield and low cost.
Location: Israel
Employees: 11-50
Total raised: $58M
Founded date: 2013
Investors 2
| Date | Name | Website |
| 31.07.2025 | Koch Disru... | kochdisrup... |
| - | Zaitoun Ve... | zaitounven... |
Funding Rounds 2
| Date | Series | Amount | Investors |
| 07.08.2025 | Series A | $50M | Samsung Ca... |
| 16.03.2021 | Series A | $8M | - |
Mentions in press and media 12
| Date | Title | Description |
| 07.08.2025 | Teramount: $50 Million Raised For AI Infrastructure Optical Connectivity | Teramount, a leader in fiber-to-chip interconnect solutions for AI and data centers, has secured $50 million in funding led by Koch Disruptive Technologies (KDT). Other participants include existing investor Grove Ventures and new partners ... |
| 30.07.2025 | Teramount Secures $50M to Power AI's Optical Future | Teramount, an Israeli innovator, raised $50 million in a pivotal funding round. Koch Disruptive Technologies led the investment. AMD Ventures, Hitachi Ventures, Samsung Catalyst Fund, Wistron, and existing investor Grove Ventures joined. Th... |
| 30.07.2025 | Teramount Raises $50M to Tackle AI's Deepest Bottleneck: Optical Connectivity at Scale With backing from AMD, Samsung Catalyst, Hitachi Ventures, and Koch Disruptive Technologies, Israeli startup Tera... | As AI models grow larger, faster, and more power-hungry, a new bottleneck has emerged - and it's not inside the chip. It's between them. Teramount, an Israeli startup building infrastructure to solve one of AI's least visible but most urgen... |
| 29.07.2025 | Teramount Raises $50M in Funding | Teramount, a Jerusalem, Israel-based company which specializes in scalable fiber-to-chip interconnect solutions for AI, data centers and advanced computing, raised $50M in funding. The round was led by Koch Disruptive Technologies (KDT). Ex... |
| 29.07.2025 | Two physicists are the brains of an Arab-Jewish startup connecting optics to chips | Two Hebrew University PhD graduates — one Muslim, the other Jewish – studied, worked together, and co-founded a nanotechnology startup to connect optical fibers to silicon photonics chips, facilitating next-generation data transfer at the s... |
| 29.07.2025 | Teramount Raises $50M to Address Growing Demand for AI Infrastructure Optical Connectivity | Koch Disruptive Technologies (KDT) leads Series A to accelerate Teramount’s transition to high-volume production, with the participation of AMD Ventures, Hitachi Ventures, Samsung Catalyst Fund, Wistron, Grove Ventures and others. Teramount... |
| 28.07.2025 | New AI Automation Platform Learns Like a Human–Infofla’s Selto V2 Now Available | Infofla, a fast-growing AI startup specializing in workflow automation, has launched Version 2 of its flagship product ‘Selto’, delivering major upgrades that dramatically improve precision, flexibility, and user control. Also Read: AiThori... |
| 02.03.2022 | EV Group and Teramount Announce Collaboration to Implement Innovative Packaging Technologies for Photonic Integrated Circuits | Breakthrough wafer-level optics technologies help solve a key challenge of connecting many fibers to silicon chips for datacom and telecom applications ST. FLORIAN, Austria and JERUSALEM, March 2, 2022 /PRNewswire/ -- EV Group (EVG), a lead... |
| 28.06.2021 | Teramount : Appoints Ilan Haber as Vice President of Product | JERUSALEM, June 28, 2021 /PRNewswire/ -- Teramount, the Silicon Photonics optical coupling device vendor, today announced the appointment of Ilan Haber as Vice President of Product. In this role Ilan will be responsible for the direction of... |
| 18.03.2021 | Teramount Raises $8-Million to Enable Silicon Photonics for Next-Generation Semiconductor Connectivity | The round led by Grove Ventures follows breakthrough results for the company’s photonic-plug technology, which enables high-speed optical connectivity for next-generation data centers, high-performance computing, 5G, sensor, and other datac... |
Show more