From cloud computing to machine learning: we constantly require more powerful chips that produce highly concentrated heat. Current cooling methods are both ineffective and inefficient, accounting for about 30% of electricity consumption in data centers. Corintis breaks these barriers, by integrating micro-scale liquid cooling directly inside the silicon, adapted to the chip. This enables a 10x improvement in cooling performance and efficiency, to enable the future of computing in a sustainable manner.
Location: Switzerland
Total raised: $49M
Investors 3
| Date | Name | Website |
| - | Wingman Ve... | wingman.ch |
| 15.04.2022 | Venture Ki... | venturekic... |
| - | VentureLab | venturelab... |
Funding Rounds 2
| Date | Series | Amount | Investors |
| 09.12.2025 | Series A | $25M | - |
| 26.09.2025 | Series A | $24M | Founderful |
Mentions in press and media 29
| Date | Title | Description |
| 31.03.2026 | 10 scale-ups selected for the first Project Switzerland batch | While Switzerland consistently ranks as a world champion in innovation, building a pipeline of Switzerland's next global giants like Nestlé, ABB, or Logitech requires significant scaling expertise. Project Switzerland, initiated by the Dee... |
| 09.12.2025 | Corintis: $25 Million Raised For Advancing Expansion | Applied Digital has made a significant strategic investment by leading a $25 million funding round for Corintis, a Swiss technology company developing microfluidic chip cooling solutions for high-performance computing and artificial intelli... |
| 06.12.2025 | Corintis Secures $25M to Cool AI | Corintis, a Swiss startup, landed $25M in funding. It'll boost global growth. The company's tech cools AI hardware efficiently. **Corintis Lands $25M to Supercharge AI Cooling Tech** The AI revolution is heating up. Literally. Power-hungry ... |
| 05.12.2025 | Corintis secured additional USD 25M Series A1 funding to accelerate its global expansion | 05.12.2025 17:30, Guillaume Tinsel Corintis, a Lausanne-based startup specializing in advanced chip cooling technology, has raised an additional USD 25 million in funding, led by Applied Digital. This brings the company’s total capital rais... |
| 05.12.2025 | Corintis secured additional USD 25M Series A1 funding to accelerate its global expansion | Swiss startup Corintis, headquartered in Lausanne, has raised an additional USD 25 million in funding led by Applied Digital, bringing its total to around USD 58 million. The company will use the capital to accelerate global expansion, scal... |
| 05.12.2025 | A further USD 25 million for Corintis | With liquid cooling becoming a prerequisite for building ultra-high-density, GPU-based compute systems, Corintis is taking the lead to introduce direct-to-chip liquid cooling solutions, utilizing microfluidic technology. Its unique generat... |
| 26.09.2025 | AI's Heat Crisis: Corintis Secures $24M to Power Next-Gen Chips | Corintis just secured $24 million in Series A funding, raising its total to $33.4 million. This investment targets AI's major bottleneck: intense chip heat. Powerful processors, vital for generative AI, generate unprecedented thermal loads.... |
| 26.09.2025 | $24M to bring chip cooling breakthrough to mass production | The growth of AI is hampered by computational power. Increasing demands for AI to become ever more powerful and ever more accessible have placed a requirement for there to be ever more powerful computer chips. However, increasingly powerfu... |
| 26.09.2025 | Corintis secures USD 24M to advance chip-cooling technology | Corintis, a semiconductor cooling startup and the last Top100 Swiss Startup Award’s first-classified winner, has emerged from stealth with a USD 24 million Series A. The company integrates cooling directly into chip design, tripling heat re... |
| 25.09.2025 | Swiss startup Corintis raises €20 million to target AI bottleneck, and collaborates with Microsoft for chip cooling breakthrough | Coming out of stealth mode, Laussane-based semiconductor cooling startup Corintis has today announced that it has raised a €20 million Series A to address the cooling bottleneck faced by computer chips in the age of AI – raising €28.5 milli... |
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